Hollow Silica
SukgyungAT is ready to supply a variety of nano sized and submicron hollow silica powders for 5G/6G communication applications, where low dielectric properties and low dielectric loss are critical. SukgyungAT’s hollow silica products feature a high hollow ratio, delivering solutions tailored to meet customer requirements. Additionally, surface treatment options are available to enhance dispersibility in customer specific formulations.
Highlights
-
Real spherical shape
-
Inert and safe material
-
Extremely low density
-
Low specific surface area (BET)
-
Low dielectric constant
-
Low dielectric loss
-
Good comparable property with PI and LCP
-
High strength
-
Low moisture absorption
Applications
-
Filler for substrates of 5G (FCCL/Rigid PCB)
-
Filler for adhesive materials for having low dielectric constant and low dielectric loss at 10GHz
Specifications
| SG-HS60PA | SG-HS300CT | SG-HS700CT | SG-HS1500CT | |
|---|---|---|---|---|
|
Average Particle
Size (㎛) |
0.06 ± 0.01
|
0.3 ± 0.1
|
0.7 ± 0.1
|
1.5 ± 0.1
|
|
Hollowness (%)
|
50 ~ 55
|
35 ~ 38
|
50 ~ 55
|
40 ~ 45
|
|
Shell thickness (㎛)
|
0.08
|
0.07
|
80.1
|
0.23
|
Customization Available
- Variety of particle sizes
- Various surface treatments