Hollow Silica
石京AT已准备好向5G/6G通信领域大规模供应满足低介电常数及低介电损耗特性需求的纳米级与亚微米级中空二氧化硅粉体。我们的中空二氧化硅具有较高的中空率，能够满足客户对不同性能的要求。
此外，为提升在客户配方体系中的分散性，我们还提供多种表面处理选项。
Highlights
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Real spherical shape
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Inert and safe material
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Extremely low density
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Low specific surface area (BET)
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Low dielectric constant
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Low dielectric loss
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Good comparable property with PI and LCP
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High strength
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Low moisture absorption
Applications
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Filler for substrates of 5G (FCCL/Rigid PCB)
-
Filler for adhesive materials for having low dielectric constant and low dielectric loss at 10GHz
Specifications
| SG-HS60PA | SG-HS300CT | SG-HS700CT | SG-HS1500CT | |
|---|---|---|---|---|
|
Average Particle
Size (㎛) |
0.06 ± 0.01
|
0.3 ± 0.1
|
0.7 ± 0.1
|
1.5 ± 0.1
|
|
Hollowness (%)
|
50 ~ 55
|
35 ~ 38
|
50 ~ 55
|
40 ~ 45
|
|
Shell thickness (㎛)
|
0.08
|
0.07
|
80.1
|
0.23
|
Customization Available
- Variety of particle sizes
- Various surface treatments